Processing apparatus, ion implantation apparatus and ion implantation method

ABSTRACT

A processing apparatus includes an end station configured to support thereon a workpiece, an ion beam generator and a scanning device. The ion beam generator is configured to generate an ion beam toward the end station. The scanning device is configured to scan the ion beam in a transverse scanning direction. The scanning device is configured to be disposed in a first path of the ion beam toward the end station and out of a second path of the ion beam toward the end station.

BACKGROUND

Ion implantation is a technology widely used in semiconductor devicemanufacturing. In an ion implantation apparatus, an ion beam isgenerated and directed at a semiconductor wafer to implant ions therein,thereby forming ion implanted regions having desired conductivity. Fordifferent types of ion implanted regions, different ion beam properties,such as beam current and/or beam energy, are used. Various types of ionimplantation apparatuses are developed to provide ion beams of differentproperties. Examples of such ion implantation apparatuses include mediumcurrent implanters (MCI), high current implanters (HCI), and high energyimplanters (HEI). Ion implantation apparatuses of different types, e.g.,MCI and HCI, are often provided as separate tools.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments are illustrated by way of example, and not bylimitation, in the figures of the accompanying drawings, whereinelements having the same reference numeral designations represent likeelements throughout. The drawings are not to scale, unless otherwisedisclosed.

FIG. 1 is a schematic block diagram of a processing apparatus inaccordance with some embodiments.

FIG. 2 is a schematic top view of an ion implantation apparatus inaccordance with some embodiments in a first mode.

FIG. 3 is a schematic top view of the ion implantation apparatus of FIG.2 in a second mode.

FIG. 4A is a schematic cross-sectional side view of an ion source of anion beam generator in accordance with some embodiments.

FIG. 4B is an exploded perspective view of an ion source of an ion beamgenerator in accordance with some embodiments.

FIGS. 5A and 5B are perspective views of a beam guide assembly of an ionbeam generator, in accordance with some embodiments, in differentoperation modes.

FIG. 5C is a schematic side view of a multi-pole electrode in accordancewith some embodiments.

FIG. 6 is a flow chart of an ion implantation method in accordance withsome embodiments.

DETAILED DESCRIPTION

It is to be understood that the following disclosure provides manydifferent embodiments or examples, for implementing different featuresof various embodiments. Specific examples of components and arrangementsare described below to simplify the present disclosure. An inventiveconcept may; however, be embodied in many different forms and should notbe construed as being limited to the embodiments set forth herein. Itwill be apparent; however, that one or more embodiments may be practicedwithout these specific details. Like reference numerals in the drawingsdenote like elements.

In a processing apparatus in accordance with some embodiments, ion beamshaving different configurations in accordance with various processingrecipes are generated. An ion beam configuration is a set of ion beamproperties including, but not limited to, beam current, beam energy andbeam profile. Ion beams are further modified before impinging uponworkpieces to be processed. For example, ion beams are modified toimprove beam uniformity and/or to adjust a beam dimension. In someoperation modes, ion beams having different configurations are modifieddifferently due to the differences in ion beam configuration. One way tofacilitate different modifications of ion beams having differentconfigurations is to transmit ion beams having different configurationsin different paths along which the ion beams are modified in accordancewith the corresponding ion beam configurations. For example, an ion beamhaving a first configuration is transmitted along a first path, whereasan ion beam having a second, different configuration is transmittedalong a second, different path toward the workpiece. The ion beam havingthe first configuration and transmitted along the first path is furtherscanned in a scanning direction transverse to the first path to adjustthe beam dimension in the scanning direction. Thus, it is possible toprovide and modify ion beams of various configurations in accordancewith various processing recipes to be applied to different workpieces.In one or more embodiments, the ion beam having the first configurationis a medium current ion beam whereas the ion beam having the secondconfiguration is a high current ion beam. Therefore, it is possible toprovide a 2-in-1 processing apparatus which combines functionalities ofan MCI with those of an HCI. As a result, one or more advantages such asreduced equipment footprint, reduced purchasing and/or maintenance cost,increased manufacturing throughput, etc., are achievable.

FIG. 1 is a schematic block diagram of a processing apparatus 100 inaccordance with some embodiments. The processing apparatus 100 comprisesan ion beam generator 110, a scanning device 120, a first intermediatemulti-pole device 130, a second intermediate multi-pole device 140, adeceleration stage 150, an output multi-pole device 160, an end station170 and a controller 180. The scanning device 120, the firstintermediate multi-pole device 130 and the output multi-pole device 160are arranged along a first path 191 between the ion beam generator 110and the end station 170. The second intermediate multi-pole device 140,the deceleration stage 150 and the output multi-pole device 160 arearranged along a second path 192 between the ion beam generator 110 andthe end station 170. The second path 192 is at least partially deviatedfrom the first path 191.

The ion beam generator 110 is configured to generate an ion beam (notnumbered in FIG. 1) having a first configuration or a secondconfiguration. The second configuration is different from the firstconfiguration in one or more ion beam properties, including, but notlimited to, —beam current, beam energy and beam profile (i.e., across-section of the ion beam). The ion beam generator 110 transmits theion beam having the first configuration along the first path 191, andthe ion beam having the second configuration along the second path 192,toward the end station 170. In one or more embodiments, the ion beamgenerator 110 includes an ion source for generating ions and a beamguide assembly for guiding and collecting the generated ions into an ionbeam. An ion source in accordance with some embodiments will bedescribed with respect to FIGS. 4A-4B. A beam guide assembly inaccordance with some embodiments will be described with respect to FIGS.5A-5C.

The scanning device 120 is located downstream of the ion beam generator110 on the first path 191 but not on the second path 192. The scanningdevice 120 is configured to scan the ion beam having the firstconfiguration in a scanning direction transverse to the first path 191.In one or more embodiments, the scanning device 120 includes a pair ofcoils for generating between the coils an electromagnetic field thatvaries in time in accordance with a frequency of the power supplied tothe pair of coils. As the ion beam is passed between the pair of coil,the time-varying electromagnetic field deflects the ions in the ion beamaccording to the left-hand rule or the right-hand rule. As a result, thewhole ion beam is reciprocally deflected, i.e., scanned, in the scanningdirection between the pair of coils. Additional details of the operationof the scanning device 120 in accordance with some embodiment will bedescribed with respect to FIGS. 2-3 and 6. Other mechanisms for scanningion beams are usable in some embodiments.

The first intermediate multi-pole device 130 is located downstream ofthe scanning device 120 on the first path 191. The first intermediatemulti-pole device 130 is configured to control parallelism of the ionbeam. In other words, the first intermediate multi-pole device 130 isconfigured to adjust trajectories of ions in the ion beam to beparallel, or as close as possible to being parallel, with the first path191 along which the ion beam is transmitted. As a result, the ion beamoutputted from the first intermediate multi-pole device 130 includesions that travel in parallel or substantially parallel trajectories.Additional details of the operation of the first intermediate multi-poledevice 130 in accordance with some embodiment will be described withrespect to FIGS. 2 and 5C. In one or more embodiments, the firstintermediate multi-pole device 130 is omitted from the processingapparatus 100.

The second intermediate multi-pole device 140 is located downstream ofthe ion beam generator 110 on the second path 192. Similar, to the firstintermediate multi-pole device 130, the second intermediate multi-poledevice 140 is configured to control parallelism of the ion beam alongthe second path 192. Additional details of the operation of the secondintermediate multi-pole device 140 in accordance with some embodimentwill be described with respect to FIGS. 3 and 5C. In one or moreembodiments, the second intermediate multi-pole device 140 is omittedfrom the processing apparatus 100.

The deceleration stage 150 is located on the second path 192 downstreamof the second intermediate multi-pole device 140. The deceleration stage150 is configured to decelerate the ion beam before the ion beam reachesthe workpiece at the end station 170. In one or more embodiments, thedeceleration stage 150 includes one or more deceleration electrodes withpositive potentials for decelerating positively charged ions in the ionbeam. Further, the deceleration stage 150 is configured to deflect theion beam on the second path 192 back to the first path 191. In one ormore embodiments, the deceleration stage 150 is turned off in one ormore operation modes. Additional details of the operation of thedeceleration stage 150 in accordance with some embodiment will bedescribed with respect to FIGS. 2-3.

The output multi-pole device 160 is common to both the first path 191and the second path 192. On the first path 191, the output multi-poledevice 160 is located downstream of the first intermediate multi-poledevice 130. On the second path 192, the output multi-pole device 160 islocated downstream of the deceleration stage 150. The output multi-poledevice 160 is configured to control uniformity of the ion beam. In otherwords, the output multi-pole device 160 is configured to adjust the beamcurrent and/or beam energy to be uniform, or as close as possible tobeing uniform, across the beam profile. As a result, the ion beamoutputted from the output multi-pole device 160 is uniform, orsubstantially uniform, across the beam profile, thereby permitting auniform dose of ions to be applied to a workpiece. Additional details ofthe operation of the output multi-pole device 160 in accordance withsome embodiment will be described with respect to FIGS. 2-3 and 5C. Inone or more embodiments, the output multi-pole device 160 is omittedfrom the processing apparatus 100.

The end station 170 is located at the end of the first path 191. The endstation 170 is configured to support a workpiece thereon. In one or moreembodiments, the workpiece is a semiconductor wafer. The end station 170includes a chuck for holding the workpiece thereon, and an actuator formoving the chuck, with the workpiece held thereon, in one or moredirections. The movements of the chuck is configured so that the ionbeam impinges in a uniform manner on the workpiece. In some embodiments,the end station 170 further includes a load lock for transferring wafersinto and out of the processing apparatus 100, and a robot arm fortransferring wafers between the chuck and the load lock. In someembodiments, the end station 170 further includes a measuring device formeasuring one or more properties of the ion beam to be impinging on theworkpiece, thereby providing feedback information for adjusting the ionbeam in accordance with a processing recipe to be applied to theworkpiece. Examples of measured ion beam properties include, but are notlimited to, beam profile, beam energy and beam current.

The controller 180 is coupled to the various components of theprocessing apparatus 100, i.e., the ion beam generator 110, the scanningdevice 120, the first intermediate multi-pole device 130, the secondintermediate multi-pole device 140, the deceleration stage 150, theoutput multi-pole device 160 and the end station 170, for controllingoperation of the various components. For example, the controller 180controls the ion beam generator 110 to vary one or more ion beamproperties, including, but not limited to, beam current, beam energy andbeam profile. The controller 180 further controls parameters, e.g., thescanning frequency, of the scanning operation of the scanning device120. The controller 180 also controls one or more of the parallelismtuning operation of the first intermediate multi-pole device 130 and thesecond intermediate multi-pole device 140, the ion beam deceleratingoperation of the deceleration stage 150, and the uniformity tuningoperation of the output multi-pole device 160. The controller 180 iscoupled to the end station 170 to control one or more of workpiecetransfer and chuck movement. In one or more embodiments, the controller180 is coupled to the measuring device provided in the end station 170to receive the feedback information for adjusting operation of one ormore of the other components of the processing apparatus 100. In someembodiments, the controller 180 is one or more computers ormicroprocessors programmed to perform one or more functions describedherein. In some embodiments, the controller 180 is one or moremicroprocessor hard-wired to perform one or more functions describedherein.

In some embodiments, the processing apparatus 100 is configured toperform ion implantation on a workpiece, such as a semiconductor wafer.Additionally, the processing apparatus 100 may be configured to performother processing using ion beams, such as film deposition or surfacetreatment. Further, the processing apparatus 100 is configured toprocess not only wafers for semiconductor devices, but also other typesof substrate, such as solar panels.

FIGS. 2 and 3 are schematic top views of an ion implantation apparatus200 in accordance with some embodiments. FIG. 2 shows the ionimplantation apparatus 200 in a first mode of operation. FIG. 3 showsthe ion implantation apparatus 200 in a second mode of operation. Theion implantation apparatus 200 is an example of the processing apparatus100 discussed with respect to FIG. 1. The ion implantation apparatus 200includes vacuum chamber 205 configured to maintain a vacuum environmentin which other components of the ion implantation apparatus 200 arecontained. The ion implantation apparatus 200 further includes, in thevacuum chamber 205, an ion beam generator 210, a scanning device 220, afirst intermediate multi-pole device 230, a second intermediatemulti-pole device 240, a deceleration stage 250, an output multi-poledevice 260 and an end station 270 similar to the corresponding ion beamgenerator 110, scanning device 120, first intermediate multi-pole device130, second intermediate multi-pole device 140, deceleration stage 150,output multi-pole device 160 and end station 170 discussed with respectto the processing apparatus 100. The ion implantation apparatus 200further includes a controller similar to the controller 180 discussedwith respect to the processing apparatus 100. The ion implantationapparatus 200 also includes an actuator 299, e.g., a motor, forphysically moving the scanning device 220 out of a path of an ion beamexiting from the ion beam generator 210 in one or more operation modes.In one or more embodiments, the actuator 299 is omitted from the ionimplantation apparatus 200, and the ion beam exiting from the ion beamgenerator 210 is deflected to avoid the scanning device 220 in one ormore operation modes. For simplicity, the second intermediate multi-poledevice 240 is not illustrated in FIG. 2, and the first intermediatemulti-pole device 230 is not illustrated in FIG. 3.

As seen in FIG. 2, the ion beam generator 210, scanning device 220,first intermediate multi-pole device 230, deceleration stage 250, outputmulti-pole device 260 and end station 270 are arranged along a firstpath 291 similar to the first path 191 discussed with respect to theprocessing apparatus 100. An X direction indicates a direction in whicha workpiece 295 supported, e.g., by a chuck, at the end station 270 isreciprocally moved during an ion implantation process. A Y directionindicates a scanning direction of the scanning device 220. A Z directionindicates a direction in which the ion beam impinges on the workpiece295. In some embodiments, the X, Y and Z directions are mutuallyperpendicular. In at least one embodiment, one or more of the X, Y and Zdirections is/are not perpendicular to the other directions. The firstpath 291 in the specifically illustrated embodiment is a straight lineextending in the Z direction. In at least one embodiment, the first path291 is not linear.

The ion beam generator 210 is partially illustrated in FIG. 2 in theform of an analyzer magnet unit (AMU) 211. In some embodiments, one ormore other components of the ion beam generator 210 is/are locateddownstream of the AMU 211 and upstream of the other components of theion implantation apparatus 200. The AMU 211 has a curved internalpassage 213 and one or more magnets (not numbered) arranged along theinternal passage 213. An ion beam enters the internal passage 213 of theAMU 211 and is bent by the magnetic field of the magnets. As a result,ions in the ion beam that have a charge-to-mass ratio outside apredetermined range are deflected into side walls 214 of the internalpassage 213. The AMU 211 allows the remaining ions in the ion beam whichhave the charge-to-mass ratio within a predetermined range to exit as anion beam B1.

The ion beam B1 exiting from the AMU 211 along the first path 291 has abeam profile 215 which is a cross-section of the ion beam takenperpendicular to the first path 291. The beam profile 215 is a spot beamprofile which has dimensions in both the X and Y directions smaller thanthe corresponding dimensions of the workpiece 295. If the ion beam withthe beam profile 215 is impinged on the workpiece 295, the end station270 will move the workpiece 295 in a two-direction (2D) scanning actionin both the X direction and the Y direction to ensure that ionimplantation is performed over the whole, or substantially the whole,surface of the workpiece 295. Such a 2D scanning action uses more timethan a single-direction (1D) scanning action along the X direction.

The scanning device 220 is configured to scan the ion beam in a scanningdirection, i.e., the direction Y, transverse to the direction Z of thefirst path 291. The scanned ion beam exiting from the scanning device220 has a beam profile 225. The beam profile 225 is formed by acombination of a plurality of beam profiles 215, e.g., 215 a-215 dillustrated in FIG. 2, as the ion beam having the beam profile 215 isdeflected by the scanning device 220 back and forth in the scanningdirection Y. In one or more embodiments, a scanning frequency of thescanning device 220 is from 60 Hz to 999 Hz. The scanning action of thescanning device 220 increases the dimension of the beam profile 225 inthe Y direction to be the same or greater than the correspondingdimension of the workpiece 295. Therefore, it is now sufficient for theend station 270 to move the workpiece 295 in a 1D scanning action alongthe X direction while still ensuring that ion implantation is performedover the whole, or substantially the whole, surface of the workpiece295. Such a 1D scanning action uses less time than a 2D scanning actiondiscussed above.

The first intermediate multi-pole device 230 is configured to controlbeam parallelism of the ion beam existing from the scanning device 220.The ion beam exiting from the first intermediate multi-pole device 230has a beam profile 235 which has improved beam parallelism, e.g., alongthe Y direction, compared to that of the beam profile 225.

The ion beam with the beam profile 235 passes through the decelerationstage 250 in a straight line along the first path 291. In one or moreembodiments, the controller of the ion implantation apparatus 200deactivates the deceleration stage 250 so that the ion beam passesthrough the deceleration stage 250 without being decelerated. In one ormore embodiments, the deceleration stage 250 is activated to deceleratethe ion beam passing there through to decrease the beam energy inaccordance with an ion implantation recipe to be applied to theworkpiece 295. For example, a positive potential is applied to either,or both, of a pair of entry electrodes 252 at an entrance of thedeceleration stage 250 and a pair of exit electrodes 254 at an exit ofthe deceleration stage 250. The positive potential has a deceleratingeffect on positively charged ions in the ion beam. In one or moreembodiments, the deceleration stage 250 is configured to accelerate theion beam passing there through to increase the beam energy in accordancewith an ion implantation recipe to be applied to the workpiece 295. Forexample, a potential applied to the exit electrodes 254 is controlled tobe more negative than a potential applied to the entry electrodes 252,thereby accelerating the ion beam toward the output multi-pole device260. The beam profile 235 is unchanged, or substantially unchanged, bythe deactivation, deceleration or acceleration in the deceleration stage250.

The output multi-pole device 260 is configured to control beamuniformity of the ion beam existing from the deceleration stage 250. Forexample, the ion beam exiting from the output multi-pole device 260 hasa beam profile 265 which has improved beam uniformity along the Ydirection compared to that of the beam profile 235. The beam profile 265has a dimension in the Y direction equal to or greater than thecorresponding dimension of the workpiece 295. Therefore, it issufficient for the end station 270 to perform a 1D scanning action alongthe X direction to ensure that the whole, or substantially the whole,surface of the workpiece 295 receives a uniform ion implantation.

In one or more embodiments, the first mode of operation described withrespect to FIG. 2 is implemented to perform a medium current ionimplantation with a beam current in the range from 1 μA to 800 μA. Sucha medium current ion implantation is suitable for forming variousfeatures in semiconductor wafers, including, but not limited to,N-wells, P-wells, N-lightly doped source/drain (LLD) pockets, P-LLDpockets, electrostatic discharge (ESD) protection features, etc.

FIG. 3 shows the ion implantation apparatus 200 in the second mode ofoperation. In this second mode, an ion beam B2 having a secondconfiguration different from the first configuration of the ion beam B1is provided by the ion beam generator 210, e.g., at the exit of the AMU211. The AMU 211 functions similarly to the first mode of operationdescribed with respect to FIG. 2, except that at the exit of the AMU211, the ion beam B2 is deflected to a second path 392 which ispartially deviated from the first path 291 and along which the secondintermediate multi-pole device 240, the deceleration stage 250 and theoutput multi-pole device 260 are arranged. In one or more embodiments, adeflecting electrode 313 is arranged at the exit of the AMU 211 and issupplied with a positive potential. The positive potential of thedeflecting electrode 313 interacts with the positively charged ions inthe ion beam and deflects the ion beam to the second path 392. Other ionbeam deflecting mechanisms are usable in some embodiments.

The ion beam exiting from the AMU 211 along the second path 392 has abeam profile 315. The beam profile 315 is a ribbon beam profile whichhas a dimension in either the X direction or the Y direction greaterthan the corresponding dimension of the workpiece 295. In thespecifically disclose embodiment, the beam profile 315 has a dimensionin the Y direction greater than the corresponding dimension of theworkpiece 295. If the ion beam with the beam profile 315 is impinged onthe workpiece 295, it is sufficient for the end station 270 to perform a1D scanning action to ensure that ion implantation is performed over thewhole, or substantially the whole, surface of the workpiece 295.

Because the ion beam having the beam profile 315 is already suitable fora 1D scanning, the scanning device 220 is not used in the second mode ofoperation, in accordance with some embodiments. In at least oneembodiment, the deflection of the ion beam from the first path 291 tothe second path 392 is sufficient to place the scanning device 220 outof the second path 392. However, in at least one embodiment, thedeflection of the ion beam to the second path 392 is insufficient forthe ion beam to avoid colliding or other interfering with the scanningdevice 220. In such a situation, the scanning device 220 is physicallymoved away from the second path 392, for example, by the actuator 299 asshown in FIG. 3.

The second intermediate multi-pole device 240 is configured to controlbeam parallelism of the ion beam transmitted from the AMU 211 along thesecond path 392. In this aspect, the second intermediate multi-poledevice 240 functions similarly to the first intermediate multi-poledevice 230. The second intermediate multi-pole device 240 is furtherconfigured to adjust a vertical angle of the ion beam. The ion beamexiting from the second intermediate multi-pole device 240 has a beamprofile 345 which has improved beam parallelism, e.g., along the Ydirection, compared to that of the beam profile 315. Further, while thebeam profile 315 has a long axis inclined with respect to the Ydirection, the beam profile 345 has a long axis which is closer to the Ydirection than the beam profile 315, i.e., the vertical angle of the ionbeam has been improved by the second intermediate multi-pole device 240.

The ion beam with the beam profile 235 passes through the decelerationstage 250 which is configured to deflect the ion beam from the secondpath 392 back to the first path 291 before the ion beam reaches theoutput multi-pole device 260. In one or more embodiments, thedeceleration stage 250 includes deflecting electrodes 352 and 354 whichare supplied with positive potentials. The positive potential of thedeflecting electrode 352 interacts with the positively charged ions inthe ion beam and deflects the ion beam toward the deflecting electrode354. The positive potential of the deflecting electrode 354 alsointeracts with the positively charged ions in the ion beam and deflectsthe ion beam toward the straight line of the first path 291. Thepositive potentials of the deflecting electrodes 352 and 354 also havedecelerating effects on the positively charged ions in the ion beam. Theion beam transmitted along the bents section of the second path 392 inthe deceleration stage 250 is decelerated to reduce the beam energy ofthe ion beam in accordance with an ion implantation recipe to be appliedto the workpiece 295. In some embodiments, additional deceleratingelectrodes are arranged to further control the beam energy. Other ionbeam deflecting and/or decelerating mechanisms are usable in someembodiments. The beam profile 345 is unchanged, or substantiallyunchanged, by the deceleration or deflection in the deceleration stage250.

The output multi-pole device 260 is configured to control beamuniformity of the ion beam existing from the deceleration stage 250similarly to the first mode of operation described with respect to FIG.2. The ion beam exiting from the output multi-pole device 260 has a beamprofile 365 which has improved beam uniformity along the Y directioncompared to that of the beam profile 345. The beam profile 365 has adimension in the Y direction equal to or greater than the correspondingdimension of the workpiece 295. Therefore, it is sufficient for the endstation 270 to perform a 1D scanning action along the X direction toensure that the whole, or substantially the whole, surface of theworkpiece 295 receives a uniform ion implantation.

In one or more embodiments, the second mode of operation described withrespect to FIG. 3 is implemented to perform a high current ionimplantation with a beam current in the range from 800 μA to 35000 μA.Such a high current ion implantation is suitable for forming variousfeatures in semiconductor wafers, including, but not limited to, N-LLDregions, P-LLD regions, N-source/drain (S/D) regions, P-S/D regions,etc.

Accordingly, it is possible, in some embodiments, to provide a 2-in-1ion implantation apparatus which functions as an MCI in the first modeof operation as described with respect to FIG. 2, and as an HCI in thesecond mode of operation as described with respect to FIG. 3. As aresult one or more advantages such as reduced equipment footprint,reduced purchasing and/or maintenance cost, increased manufacturingthroughput, etc., are achievable.

When the ion implantation apparatus 200 functions as an MCI in the firstmode of operation in accordance with some embodiments, the ion beam B1generated by the ion beam generator 210 has a lower beam current thanthe ion beam B2 generated by the ion beam generator 210 in the secondmode of operation. By keeping the beam profile of the ion beam B1 small,e.g., as a spot beam profile, uniformity of the ion beam B1 ispreserved. The scanning action of the scanning device 220 then convertsthe spot beam profile of the ion beam B1 to a ribbon-like beam profile,thereby permitting the end station 270 to perform a 1D scanning actionwhich uses less time than a 2D scanning action that would be otherwiseperformed if the ion beam B1 with the spot beam profile was useddirectly for ion implantation. The first intermediate multi-pole device230 and the output multi-pole device 260 further improve beamparallelism and beam uniformity before the scanned ion beam is used forion implantation. In some embodiments, the beam energy is adjusted,e.g., accelerated, in accordance with the ion implantation recipe to beapplied to the workpiece 295. As a result, a uniform, low current, highenergy ion implantation is achievable with a 1D scanning action.

When the ion implantation apparatus 200 functions as an HCI in thesecond mode of operation in accordance with some embodiments, the ionbeam B2 generated by the ion beam generator 210 has a higher beamcurrent than the ion beam B1 generated by the ion beam generator 210 inthe first mode of operation. As a result, it is possible to provide theion beam B2 in a large beam profile, e.g., as a ribbon beam profile. Thescanning action of the scanning device 220 is not performed in at leastone embodiment. The second intermediate multi-pole device 240 and theoutput multi-pole device 260 further improve beam parallelism, beamvertical angle and beam uniformity before the ion beam is used for ionimplantation. In some embodiments, the beam energy is adjusted, e.g.,decelerated, in accordance with the ion implantation recipe to beapplied to the workpiece 295. As a result, a uniform, high current, lowenergy ion implantation is achievable with a 1D scanning action.

FIG. 4A is a schematic cross-sectional side view of an ion source 400which is a part of an ion beam generator usable as the ion beamgenerator 110 or the ion beam generator 210 in accordance with someembodiments. The ion source 400 includes an arc chamber 412 housingtherein an electrode 414 which is connected to a power source 416. Thearc chamber 412 has a port 418 connected to a working gas supply 420.The arc chamber 412 further includes an arc slit 422. The ion source 400further includes an extraction electrode 424 having an extraction slit426 that is disposed opposite the arc slit 422. In operation, a workinggas of a dopant to be ionized is supply from the working gas supply 420through the port 418 into the arc chamber 412. In addition, radiofrequency (RF) or microwave power is supplied to the electrode 414 fromthe power source 416 to excite free electrons within the arc chamber412. The excited electrons collide with the gas molecules to generateions. The generated ions which are positively charged are extractedthrough the arc slit 422 and the extraction slit 426 by supplying anegative potential to the extraction electrode 424. The extracted ionsare guided and collected into an ion beam as described with respect toFIGS. 5A-5C. By controlling various factors, such as excitation power,extraction power etc., it is possible to control a configuration of thegenerated ion beam to provide either an ion beam suitable for the firstmode of operation of the ion implantation apparatus 200 or an ion beamsuitable for the second mode of operation of the ion implantationapparatus 200.

FIG. 4B is an exploded perspective view of an alternative ion source 450in accordance with some embodiments. The ion source 450 includes atleast two arc chambers, and accordingly, at least two arc slits and atleast two extraction slits. In the specifically disclosed embodiment inFIG. 4B, the ion source 450 is a dual ion source having two arc chambers454, 456, two corresponding arc slits 464, 466 and two correspondingextraction slits 474, 476. Ion streams extracted from the extractionslits 474, 476 are merged into a single, common ion beam to be used forion implantation.

The arc chamber 454 and the arc chamber 456 are configured to operateindividually or together to vary at least one of beam current or beamenergy of the common ion beam. For example, in at least one embodiment,the arc chamber 454 is configured to operate individually while the arcchamber 456 is turned off. The ion beam generated by the arc chamber 454has a beam current in a range from 1 μA to 800 μA which is suitable, inat least one embodiment, as the ion beam B1 for used in the first modeof operation of the ion implantation apparatus 200. In at least oneembodiment, both the arc chamber 454 and the arc chamber 456 areoperated at the same time to generate together an ion beam having a beamcurrent in a range from 800 μA to 35000 μA which is suitable, in atleast one embodiment, as the ion beam B2 for used in the second mode ofoperation of the ion implantation apparatus 200. In at least oneembodiment, the arc chamber 456 is operated individually while the arcchamber 454 is turned off to provide further flexibility in current beamand/or current energy adjustment.

FIGS. 5A and 5B are perspective views of a beam guide assembly 500 whichis another part of an ion beam generator usable as the ion beamgenerator 110 or the ion beam generator 210 in accordance with someembodiments. FIG. 5A shows the beam guide assembly 500 in a first modecorresponding to the first mode or operation of the ion implantationapparatus 200. FIG. 5B shows the beam guide assembly 500 in a secondmode corresponding to the second mode or operation of the ionimplantation apparatus 200.

The beam guide assembly 500 is positioned downstream of an ion source,such as the ion source 400 or ion source 450 described with respect toFIGS. 4A-4B, to collect and guide the extracted ion stream(s) into anion beam. The beam guide assembly 500 includes an AMU 511 and at leastone multi-pole device. In the specifically disclosed embodiment, the AMU511 is similar to the AMU 211 described with respect to FIG. 2, and thebeam guide assembly 500 includes a first multi-pole device 513, a secondmulti-pole device 515 downstream of the first multi-pole device 513, anda third multi-pole device 517 further downstream of the secondmulti-pole device 515. In some embodiments, one or more of themulti-pole devices 513, 515, 517 is/are omitted.

In some embodiments, the first multi-pole device 513 is configured as alinear multi-pole device to confine the ion beam exiting from the AMU511 in the X direction between a pair of multi-pole electrodes of thefirst multi-pole device 513. The second multi-pole device 515 isconfigured as a lens to diverge or converge the ion beam in the Ydirection, depending on the control voltages applied to multi-poleelectrodes of the second multi-pole device 515. The third multi-poledevice 517 is configured as a collimator to cause ions in the ion beamto travel in parallel to the Z direction.

In the first mode of the beam guide assembly 500 as illustrated in FIG.5A, the second multi-pole device 515 is configured as a converging lensto converge the ion beam as indicated at 519. The collimated ion beam520 exiting from the third multi-pole device 517 has a small beamprofile, e.g., a spot beam profile, suitable as the ion beam B1 used inthe first mode of operation of the ion implantation apparatus 200. Inthe second mode of the beam guide assembly 500 as illustrated in FIG.5B, the second multi-pole device 515 is configured as a diverging lensto diverge the ion beam as indicated at 516. The collimated ion beam 518exiting from the third multi-pole device 517 has a large beam profile,e.g., a ribbon beam profile, suitable as the ion beam B2 used in thesecond mode of operation of the ion implantation apparatus 200. In oneor more embodiments, the second multi-pole device 515 is omitted orconfigured as a converging lens which converge the ion beam whilekeeping the beam profile in the ribbon shape for use in the second modeof operation of the ion implantation apparatus 200.

FIG. 5C is a schematic side view of a multi-pole electrode 521 inaccordance with some embodiments. The multi-pole electrode 521 includesa core 523, and one or more coils 525, 527, 529, 531 wound around thecore 523. Each coil 525, 527, 529, 531 is individually controlled by aseparate voltage applied thereto. By varying voltages individuallyapplied to the coils 525, 527, 529, 531, electromagnetic fields alongthe core 523 is locally variable. Several multi-pole electrodes similarto the multi-pole electrode 521 are arranged adjacent each other todefine a multi-pole device. By varying physical arrangements among themulti-pole electrodes of a multi-pole device and/or varying controlvoltages applied individually to the coils of each multi-pole electrode,various functions and/or effects of the multi-pole devices describedwith respect to FIGS. 1-3 and 5A-5B are achievable.

In some embodiments, by providing an ion source, such as the ion source450, with multiple arc chambers, beam current and/or beam energy of agenerated ion beam is/are adjustable in a wide range. Depending on thebeam current and/or beam energy of the generated ion beam, the ion beamis shaped to have an appropriate beam profile, e.g., a spot beam profilefor a low current ion beam or a ribbon beam profile for a high currention beam. As a result, ion beams of appropriate configurations aregenerated for use with the first and second modes of operation of theion implantation apparatus 200. The manufacturing flexibility isenhanced whereas process control is simplified. In one or moreembodiments, the ion implantation apparatus 200 is configured to processlarge wafers, e.g., 450 mm wafers.

FIG. 6 is a flow chart of an ion implantation method 600 in accordancewith some embodiments. The method 600 is performed in at least oneembodiment by the ion implantation apparatus 200.

At operation 610, a first ion beam having a first configuration or asecond ion beam having a second, different configuration is generated.For example, as described with respect to FIGS. 2-3, an ion beam B1 oran ion beam B2 having a configuration different from the configurationof the ion beam B1 is generated. The method then proceeds to operation620 or operation 630.

At operation 620, the first ion beam having the first configuration isscanned and then directed along a first path at a workpiece. Forexample, as described with respect to FIG. 2, when the ion beam B1 isgenerated, the ion beam B1 is scanned by the scanning device 220 in theY direction, and the scanned ion beam is transmitted along the firstpath 291 at a workpiece 295.

At operation 630, the second ion beam having the second configuration isdirected along a second, different path at the workpiece. For example,as described with respect to FIG. 3, when the ion beam B2 is generated,the ion beam B2 is transmitted along the second path 392 at theworkpiece 295.

The above method(s) include(s) example operations, which are notnecessarily required to be performed in the order shown and/ordescribed. Operations may be added, replaced, changed order, and/oreliminated as appropriate, in accordance with the spirit and scope ofembodiments of the disclosure. Embodiments that combine differentfeatures and/or different embodiments are within the scope of thedisclosure and will be apparent to those of ordinary skill in the artafter reviewing this disclosure. For example, although positivelycharged ions are discussed in the above description, negatively chargedions are usable for ion implantation in some embodiments.

According to some embodiments, a processing apparatus comprises an endstation configured to support thereon a workpiece, an ion beam generatorand a scanning device. The ion beam generator is configured to generatean ion beam toward the end station. The scanning device is configured toscan the ion beam in a transverse scanning direction. The scanningdevice is configured to be disposed in a first path of the ion beamtoward the end station and out of a second path of the ion beam towardthe end station and.

According to some embodiments, an ion implantation apparatus comprisesan end station configured to support thereon a workpiece to be ionimplanted, an ion beam generator, a scanning device, a decelerationstage and an output multi-pole device. The ion beam generator isconfigured to generate an ion beam toward the end station. The ion beamhas a first configuration or a second configuration different from thefirst configuration. The scanning device is located on a first pathdownstream of the ion beam generator, and configured to scan the ionbeam having the first configuration and transmitted along the first pathin a scanning direction transverse to the first path. The decelerationstage is located on a second path downstream of the ion beam generator,and configured to decelerate the ion beam having the secondconfiguration and transmitted along the second path. The second path ispartially deviated from the first path. The output multi-pole device iscommon to both the first path and the second path. The output multi-poledevice is located on the first path between the scanning device and theend station, and on the second path between the ion beam generator andthe end station. The output multi-pole device is configured to controluniformity of the ion beam before the ion beam reaches the workpiecesupported at the end station.

According to some embodiments, an ion implantation method comprisesgenerating a first ion beam or a second ion beam, the first ion beamhaving a different configuration from the second ion beam. The methodfurther comprises either (i) scanning and directing the first ion beamat a workpiece to perform ion implantation on the workpiece, or (ii)directing the second ion beam at the workpiece to perform ionimplantation on the workpiece. The first ion beam and the second ionbeam follow different paths.

It will be readily seen by one of ordinary skill in the art that one ormore of the disclosed embodiments fulfill one or more of the advantagesset forth above. After reading the foregoing specification, one ofordinary skill will be able to affect various changes, substitutions ofequivalents and various other embodiments as broadly disclosed herein.It is therefore intended that the protection granted hereon be limitedonly by the definition contained in the appended claims and equivalentsthereof.

What is claimed is:
 1. A processing apparatus, comprising: an endstation configured to support thereon a workpiece; an ion beam generatorconfigured to generate an ion beam toward the end station; and ascanning device configured to scan the ion beam in a transverse scanningdirection; wherein the scanning device is configured to be disposed in afirst path of the ion beam toward the end station and out of a secondpath of the ion beam toward the end station.
 2. The processing apparatusof claim 1, further comprising: an output multi-pole device common toboth the first path and the second path, the output multi-pole devicelocated on the first path between the scanning device and the endstation, and on the second path between the ion beam generator and theend station; wherein the output multi-pole device is configured tocontrol uniformity of the ion beam before the ion beam reaches theworkpiece supported at the end station.
 3. The processing apparatus ofclaim 2, further comprising: a multi-pole device configured to controlparallelism of the ion beam before the ion beam reaches the outputmulti-pole device.
 4. The processing apparatus of claim 3, wherein themulti-pole device is a first intermediate multi-pole device located onthe first path between the scanning device and the output multi-poledevice.
 5. The processing apparatus of claim 3, wherein the multi-poledevice is a second intermediate multi-pole device located on the secondpath between the ion beam generator and the output multi-pole device. 6.The processing apparatus of claim 2, further comprising: a decelerationstage disposed between the ion beam generator and the output multi-poledevice, wherein the deceleration stage is configured to linearlydecelerate the ion beam in the first path or to deflect the ion beam inthe second path.
 7. The processing apparatus of claim 1, wherein the ionbeam generator includes at least two arc chambers configured to operateindividually or in combination to vary at least one of a beam current orbeam energy of the ion beam.
 8. The processing apparatus of claim 1,wherein the scanning device is physically moveable out of the secondpath.
 9. An ion implantation apparatus, comprising: an end stationconfigured to support thereon a workpiece to be ion implanted; an ionbeam generator configured to generate an ion beam toward the endstation, the ion beam having a first configuration or a secondconfiguration different from the first configuration; a scanning devicelocated on a first path downstream of the ion beam generator andconfigured to scan the ion beam having the first configuration andtransmitted along the first path in a scanning direction transverse tothe first path; a deceleration stage located on a second path downstreamof the ion beam generator and configured to decelerate the ion beamhaving the second configuration and transmitted along the second path,the second path partially deviated from the first path; and an outputmulti-pole device common to both the first path and the second path, theoutput multi-pole device located on the first path between the scanningdevice and the end station, and on the second path between the ion beamgenerator and the end station, the output multi-pole device configuredto control uniformity of the ion beam before the ion beam reaches theworkpiece supported at the end station.
 10. The ion implantationapparatus of claim 9, further comprising: a first intermediatemulti-pole device located on the first path between the scanning deviceand the output multi-pole device, the first intermediate multi-poledevice configured to control parallelism of the ion beam passingtherethrough before the ion beam reaches the output multi-pole device.11. The ion implantation apparatus of claim 10, further comprising: asecond intermediate multi-pole device located on the second path betweenthe ion beam generator and the deceleration stage, the second multi-poledevice configured to control parallelism of the ion beam passingtherethrough before the ion beam reaches the output multi-pole device.12. The ion implantation apparatus of claim 11, further comprising: avacuum chamber in which the ion beam generator, the scanning device, thefirst and second intermediate multi-pole device, the deceleration stageand the output multi-pole device are contained.
 13. The ion implantationapparatus of claim 11, wherein the deceleration stage is further locatedon the first path between the scanning device and the output multi-poledevice, the first path extending linearly through the decelerationstage, the second path having a bent section in the deceleration stage.14. The ion implantation apparatus of claim 13, wherein the ion beamgenerator includes a dual ion source.
 15. The ion implantation apparatusof claim 9, further comprising: an actuator configured to physicallymove the scanning device out of the second path in response to the ionbeam generator generating the ion beam having the second configurationalong the second path.
 16. An ion implantation method, the methodcomprising: generating a first ion beam or a second ion beam, the firstion beam having a different configuration from the second ion beam;scanning and directing the first ion beam at a workpiece to perform ionimplantation on the workpiece; or directing the second ion beam at theworkpiece to perform ion implantation on the workpiece; wherein thefirst ion beam and the second ion beam follow different paths.
 17. Themethod of claim 16, further comprising decelerating the second ion beambefore directing the second ion beam at the workpiece.
 18. The method ofclaim 17, further comprising accelerating the scanned first ion beambefore directing the first ion beam at the workpiece.
 19. The method ofclaim 16, wherein the first configuration includes a spot beam profileand the second configuration includes a ribbon beam profile.
 20. Themethod of claim 19, wherein the first configuration has a lower beamcurrent than the second configuration.